FiiO R9 DAC Chips All-in-One

Description

Haupt-SoC: Qualcomm Snapdragon 660

OS: Highly customized Android 10 (FiiO plans to upgrade the OS to Android 12 in Q1 2024)

DAC: 8-Channel ES9038PRO*2

Headphone amplifier: Quad THX AAA 788+

Bluetooth-Chip: QCC5125

Bluetooth-Version: 5.1

Bluetooth Codec Support: LDAC/aptX Adaptive/aptX LL/aptX HD/aptX/AAC/SBC USB: XMOS XU316

USB-DAC: 768kHz/32bit, DSD512

USB-Typ: Typ-C USB3.0, USB-A

Display: 6-inch FHD + edgeless screen (2160*1080)

Output power 1: L+R≥7300mW+7000mW (32Ω, BAL, THD+N＜1%, Ultra high gain mode)

Output Power 2: L+R≥1000mW+1000mW (300Ω, BAL, THD+N＜1%, Ultra-High Gain Mode)

Frequency response: 20Hz~80kHz (0.9dB)

Signal-to-noise ratio: ≥126dB (A-weighted)

Noise floor1: LO≤1.4μV (A-weighted); PO≤4μV (A-weighted)

Noise floor2: BAL LO≤1.9μV (A-weighted); BAL≤7μV (A-weighted)

Output impedance: ＜0.6Ω (32Ω load)

THD+N≤0.0002% (1kHz/-1.8dB@32Ω)

RAM: 4GB

Internal memory: 64GB

Memory card support: Standard microSD card slot, supports up to 2 TB

Dimensions: Approx. 115x127x160mm (without base) Approx. 115x127x170mm (including base) Approx. 115x127x182.5mm (including 7° tilted base)

Weight: About 2271g

Additional information